Chip Quik, Inc.

- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.

Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.

Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.

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Part Number

Manufacturer

Description

Unit Price

In Stock

BGA0009-S

Chip Quik, Inc.

Type : BGA Number of Positions : 484 Pitch : 0.050" (1.27mm) Outer Dimension : 1.800" L x 2.600" W (45.72mm x 66.04mm) Inner Dimension : - Thermal Center Pad : -

From $22.45

3 in stock

BGA0010

Chip Quik, Inc.

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : BGA Number of Positions : 42 Pitch : 0.020" (0.50mm) Board Thickness : 0.062" (1.57mm) 1/16" Material : FR4 Epoxy Glass Size / Dimension : 0.700" x 2.100" (17.78mm x 53.34mm)

From $37.42

100 in stock

BGA0010-S

Chip Quik, Inc.

Type : BGA Number of Positions : 42 Pitch : 0.020" (0.50mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -

From $21.29

1 in stock

BGA0011

Chip Quik, Inc.

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : BGA Number of Positions : 25 Pitch : 0.020" (0.50mm) Board Thickness : 0.062" (1.57mm) 1/16" Material : FR4 Epoxy Glass Size / Dimension : 0.700" x 1.300" (17.78mm x 33.02mm)

From $21.29

100 in stock

BGA0011-S

Chip Quik, Inc.

Type : BGA Number of Positions : 25 Pitch : 0.020" (0.50mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -

From $21.29

100 in stock

BGA0012

Chip Quik, Inc.

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : BGA Number of Positions : 54 Pitch : 0.047" (1.20mm) Board Thickness : - Material : - Size / Dimension : -

From $40.41

100 in stock

BGA0012-S

Chip Quik, Inc.

Type : BGA Number of Positions : 54 Pitch : 0.047" (1.20mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -

From $24.23

100 in stock

BGA0014

Chip Quik, Inc.

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : BGA Number of Positions : 54 Pitch : 0.029" (0.75mm) Board Thickness : 0.062" (1.57mm) 1/16" Material : FR4 Epoxy Glass Size / Dimension : 1.000" x 2.700" (25.40mm x 68.58mm)

From $35.49

100 in stock

BGA0014-S

Chip Quik, Inc.

Type : BGA Number of Positions : 54 Pitch : 0.029" (0.75mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -

From $21.29

100 in stock

BGA0015

Chip Quik, Inc.

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to PGA Package Accepted : BGA Number of Positions : 100 Pitch : 0.026" (0.65mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.900" x 1.900" (48.26mm x 48.26mm)

From $59.82

100 in stock

BGA0015-S

Chip Quik, Inc.

Type : BGA Number of Positions : 100 Pitch : 0.026" (0.65mm) Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm) Inner Dimension : - Thermal Center Pad : -

From $24.23

100 in stock

BGA0016

Chip Quik, Inc.

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : BGA Number of Positions : 25 Pitch : 0.016" (0.40mm) Board Thickness : - Material : - Size / Dimension : -

From $26.27

100 in stock