Manufacturer : Aries Electronics Packaging : Bulk Series : 0513 Part Status : Active Type : SIP Number of Positions or Pins (Grid) : 5 (1 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : - Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : 518 Part Status : Active Type : SIP Number of Positions or Pins (Grid) : 6 (1 x 6) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : 518 Part Status : Active Type : SIP Number of Positions or Pins (Grid) : 6 (1 x 6) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Lo-PRO?file, 513 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 6 (2 x 3) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : 0513 Part Status : Active Type : SIP Number of Positions or Pins (Grid) : 7 (1 x 7) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : - Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Texas Instruments Packaging : Bulk Series : - Part Status : Active Type : Transistor, TO-3 Number of Positions or Pins (Grid) : 8 (Oval) Pitch - Mating : - Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Closed Frame Termination : Solder Pitch - Post : - Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyester, Glass Filled Operating Temperature : -55°C ~ 150°C

Manufacturer : Aries Electronics Packaging : Bulk Series : 518 Part Status : Active Type : SIP Number of Positions or Pins (Grid) : 8 (1 x 8) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : 503 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Closed Frame Termination : Wire Wrap Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Phosphor Bronze Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -55°C ~ 105°C

Manufacturer : Aries Electronics Packaging : Bulk Series : Lo-PRO?file, 513 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : 518 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Surface Mount Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : 518 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : 518 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -