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Part Number

Manufacturer

Description

Unit Price

In Stock

XL25-20-20-2

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : - Shape : Square Length : 0.787" (20.00mm) Width : 0.787" (20.00mm) Diameter : - Height Off Base (Height of Fin) : 0.079" (2.00mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $0.20

5133 in stock

XL25-30-30-2

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : - Shape : Square Length : 1.181" (30.00mm) Width : 1.181" (30.00mm) Diameter : - Height Off Base (Height of Fin) : 0.079" (2.00mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $0.40

448 in stock

XL25-40-40-2

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : - Shape : Square Length : 1.575" (40.00mm) Width : 1.575" (40.00mm) Diameter : - Height Off Base (Height of Fin) : 0.079" (2.00mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $0.74

260 in stock

XL25-40-40-3

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : - Shape : Square Length : 1.575" (40.00mm) Width : 1.575" (40.00mm) Diameter : - Height Off Base (Height of Fin) : 0.118" (3.00mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $0.67

3110 in stock

XLI98-10-2.25-P

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : Thermal Tape, Adhesive (Included) Shape : Square Length : 0.394" (10.00mm) Width : 0.394" (10.00mm) Diameter : - Height Off Base (Height of Fin) : 0.089" (2.25mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $0.34

100 in stock

XLI98-20-2.25-P

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : Thermal Tape, Adhesive (Included) Shape : Square Length : 0.787" (20.00mm) Width : 0.787" (20.00mm) Diameter : - Height Off Base (Height of Fin) : 0.089" (2.25mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $0.29

2343 in stock

XLI98C-10-2.15-P

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : Thermal Tape, Adhesive (Included) Shape : Square Length : 0.394" (10.00mm) Width : 0.394" (10.00mm) Diameter : - Height Off Base (Height of Fin) : 0.085" (2.15mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $0.38

100 in stock

XLI98C-20-2.15-P

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : Thermal Tape, Adhesive (Included) Shape : Square Length : 0.787" (20.00mm) Width : 0.787" (20.00mm) Diameter : - Height Off Base (Height of Fin) : 0.085" (2.15mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $0.41

896 in stock

XLI98C-30-2.15-P

t-Global Technology

Manufacturer : t-Global Technology Series : XL-25 Part Status : Active Type : Heat Spreader Package Cooled : Assorted (BGA, LGA, CPU, ASIC...) Attachment Method : Thermal Tape, Adhesive (Included) Shape : Square Length : 1.181" (30.00mm) Width : 1.181" (30.00mm) Diameter : - Height Off Base (Height of Fin) : 0.085" (2.15mm) Power Dissipation @ Temperature Rise : - Thermal Resistance @ Forced Air Flow : - Thermal Resistance @ Natural : - Material : Ceramic Material Finish : -

From $1.03

100 in stock