Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 925MHz Primary Attributes : FPGA - 25K Logic Elements Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 672-FBGA Supplier Device Package : 672-UBGA (23x23)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 600MHz Primary Attributes : FPGA - 25K Logic Elements Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 672-FBGA Supplier Device Package : 672-UBGA (23x23)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 600MHz Primary Attributes : FPGA - 40K Logic Elements Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 672-FBGA Supplier Device Package : 672-UBGA (23x23)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 800MHz Primary Attributes : FPGA - 40K Logic Elements Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 672-FBGA Supplier Device Package : 672-UBGA (23x23)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 600MHz Primary Attributes : FPGA - 85K Logic Elements Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 896-BGA Supplier Device Package : 896-FBGA (31x31)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 600MHz Primary Attributes : FPGA - 110K Logic Elements Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 672-FBGA Supplier Device Package : 672-UBGA (23x23)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 800MHz Primary Attributes : FPGA - 110K Logic Elements Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 672-FBGA Supplier Device Package : 672-UBGA (23x23)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 925MHz Primary Attributes : FPGA - 110K Logic Elements Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 896-BGA Supplier Device Package : 896-FBGA (31x31)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 600MHz Primary Attributes : FPGA - 110K Logic Elements Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 896-BGA Supplier Device Package : 896-FBGA (31x31)

Manufacturer : Intel Packaging : Tray Series : Cyclone? V SX Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 800MHz Primary Attributes : FPGA - 110K Logic Elements Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 896-BGA Supplier Device Package : 896-FBGA (31x31)

Manufacturer : Microsemi Corporation Packaging : Tray Series : SmartFusion? Part Status : Active Architecture : MCU, FPGA Core Processor : ARM? Cortex?-M3 Flash Size : 256KB RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed : 80MHz Primary Attributes : ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 256-LBGA Supplier Device Package : 256-FBGA (17x17)

Manufacturer : Microsemi Corporation Packaging : Tray Series : SmartFusion? Part Status : Active Architecture : MCU, FPGA Core Processor : ARM? Cortex?-M3 Flash Size : 512KB RAM Size : 64KB Peripherals : DMA, POR, WDT Connectivity : EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed : 100MHz Primary Attributes : ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 484-BGA Supplier Device Package : 484-FPBGA (23x23)