Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 766MHz Primary Attributes : Artix?7 FPGA, 85K Logic Cells Operating Temperature : 0°C ~ 100°C (TJ) Package / Case : 484-LFBGA, CSPBGA Supplier Device Package : 484-CSPBGA (19x19)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 766MHz Primary Attributes : Artix?7 FPGA, 85K Logic Cells Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 484-LFBGA, CSPBGA Supplier Device Package : 484-CSPBGA (19x19)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 866MHz Primary Attributes : Artix?7 FPGA, 85K Logic Cells Operating Temperature : 0°C ~ 100°C (TJ) Package / Case : 400-LFBGA, CSPBGA Supplier Device Package : 400-CSPBGA (17x17)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 866MHz Primary Attributes : Artix?7 FPGA, 85K Logic Cells Operating Temperature : 0°C ~ 100°C (TJ) Package / Case : 484-LFBGA, CSPBGA Supplier Device Package : 484-CSPBGA (19x19)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 667MHz Primary Attributes : Kintex?7 FPGA, 125K Logic Cells Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 484-BBGA, FCBGA Supplier Device Package : 484-FCBGA (23x23)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 667MHz Primary Attributes : Kintex?7 FPGA, 125K Logic Cells Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 484-BBGA, FCBGA Supplier Device Package : 484-FCBGA (23x23)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 667MHz Primary Attributes : Kintex?7 FPGA, 125K Logic Cells Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 676-BBGA, FCBGA Supplier Device Package : 676-FCBGA (27x27)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 667MHz Primary Attributes : Kintex?7 FPGA, 125K Logic Cells Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 676-BBGA, FCBGA Supplier Device Package : 676-FCBGA (27x27)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 667MHz Primary Attributes : Kintex?7 FPGA, 125K Logic Cells Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 676-BBGA, FCBGA Supplier Device Package : 676-FCBGA (27x27)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 667MHz Primary Attributes : Kintex?7 FPGA, 125K Logic Cells Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 676-BBGA, FCBGA Supplier Device Package : 676-FCBGA (27x27)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 667MHz Primary Attributes : Kintex?7 FPGA, 125K Logic Cells Operating Temperature : 0°C ~ 85°C (TJ) Package / Case : 484-FBGA Supplier Device Package : 485-FBGA (19x19)

Manufacturer : Xilinx Inc. Packaging : Tray Series : Zynq?-7000 Part Status : Active Architecture : MCU, FPGA Core Processor : Dual ARM? Cortex?-A9 MPCore?with CoreSight? Flash Size : - RAM Size : 256KB Peripherals : DMA Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed : 667MHz Primary Attributes : Kintex?7 FPGA, 125K Logic Cells Operating Temperature : -40°C ~ 100°C (TJ) Package / Case : 484-FBGA Supplier Device Package : 485-FBGA (19x19)