PA-SOD3SM18-18
PA-SOD3SM18-18
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SOIC
Number of Positions : 18
Pitch : 0.050" (1.27mm)
Board Thickness : 0.031" (0.79mm) 1/32"
Material : -
Size / Dimension : 0.950" L x 0.500" W (24.13mm x 12.70mm)
Availability: 28 in stock
$10.81
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