Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : TSSOP Number of Positions : 56 Pitch : 0.020" (0.50mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 2.800" W (25.40mm x 71.12mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : TSSOP Number of Positions : 64 Pitch : 0.020" (0.50mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 3.200" W (25.40mm x 81.28mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : QFN Number of Positions : 14 Pitch : 0.020" (0.50mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 0.900" W (25.40mm x 22.86mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : QFN Number of Positions : 12 Pitch : 0.016" (0.40mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 0.600" W (25.40mm x 15.24mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : LGA Number of Positions : 10 Pitch : 0.016" (0.40mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 0.500" W (25.40mm x 12.70mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : PowerSOIC Number of Positions : 20 Pitch : 0.050" (1.27mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 1.200" W (25.40mm x 30.48mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : PowerSOIC Number of Positions : 24 Pitch : 0.050" (1.27mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 1.400" W (25.40mm x 35.56mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : PowerSOIC Number of Positions : 28 Pitch : 0.050" (1.27mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 1.600" W (25.40mm x 40.64mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : QFN Number of Positions : 24 Pitch : 0.020" (0.50mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 1.400" W (25.40mm x 35.56mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : QFN Number of Positions : 28 Pitch : 0.020" (0.50mm) Board Thickness : 0.063" (1.60mm) Material : FR4 Epoxy Glass Size / Dimension : 1.000" L x 1.600" W (25.40mm x 40.64mm)

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : QFN Number of Positions : 28 Pitch : 0.026" (0.65mm) Board Thickness : - Material : - Size / Dimension : -

Manufacturer : Chip Quik Inc. Series : Proto-Advantage Part Status : Active Proto Board Type : SMD to DIP Package Accepted : - Number of Positions : - Pitch : 0.047" (1.20mm) Board Thickness : - Material : - Size / Dimension : -