Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter : - Melting Point : 281°F (138°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Syringe, 0.53 oz (15g), 5cc Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter : - Melting Point : 281°F (138°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Syringe, 1.23 oz (35g), 10cc Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter : - Melting Point : 281°F (138°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Jar, 8.8 oz (250g) Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter : - Melting Point : 281°F (138°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Jar, 1.76 oz (50g) Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter : - Melting Point : 281°F (138°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Cartridge, 17.64 oz (500g) Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter : - Melting Point : 423 ~ 428°F (217 ~ 220°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Syringe, 0.53 oz (15g), 5cc Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter : - Melting Point : 423 ~ 428°F (217 ~ 220°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Syringe, 1.23 oz (35g), 10cc Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter : - Melting Point : 423 ~ 428°F (217 ~ 220°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Jar, 8.8 oz (250g) Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter : - Melting Point : 423 ~ 428°F (217 ~ 220°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Jar, 1.76 oz (50g) Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)

Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Solder Paste Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter : - Melting Point : 423 ~ 428°F (217 ~ 220°C) Flux Type : No-Clean Wire Gauge : - Process : Lead Free Form : Cartridge, 17.64 oz (500g) Shelf Life : 12 Months Shelf Life Start : Date of Manufacture Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)