RF360 - A Qualcomm-TDK joint venture

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : - Part Status : Obsolete Frequency - Center : 881.5/942.5MHz Bandwidth : 25MHz, 35MHz Insertion Loss : 1.6dB Ratings : - Applications : General Purpose Mounting Type : Surface Mount Package / Case : 10-SMD, No Lead Height (Max) : 0.019" (0.47mm) Size / Dimension : 0.071" L x 0.055" W (1.80mm x 1.40mm)

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Obsolete Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Obsolete Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : Bulk Series : B9509 Part Status : Obsolete Frequency Bands (Low / High) : 869MHz ~ 894MHz / 925MHz ~ 960MHz Low Band Attenuation (min / max dB) : 24.00dB/ 30.00dB High Band Attenuation (min / max dB) : 25.00dB/ 28.00dB Return Loss (Low Band / High Band) : - Mounting Type : Surface Mount Package / Case : 10-SMD, No Lead

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Obsolete Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : - Part Status : Obsolete Frequency - Center : 881.5/942.5MHz Bandwidth : 25MHz, 35MHz Insertion Loss : 1.9dB Ratings : - Applications : General Purpose Mounting Type : Surface Mount Package / Case : 10-SMD, No Lead Height (Max) : 0.027" (0.68mm) Size / Dimension : 0.071" L x 0.055" W (1.80mm x 1.40mm)

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : - Part Status : Obsolete Frequency - Center : 881.5/942.5MHz Bandwidth : 25MHz, 35MHz Insertion Loss : 1.8dB Ratings : - Applications : General Purpose Mounting Type : Surface Mount Package / Case : 10-SMD, No Lead Height (Max) : 0.027" (0.68mm) Size / Dimension : 0.071" L x 0.055" W (1.80mm x 1.40mm)

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Obsolete Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -

Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -