RF360 - A Qualcomm-TDK joint venture
- We offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
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Part Number
Manufacturer
Description
Unit Price
In Stock
B39941B9803P810A1
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9803P810A5
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9803P810A99
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9803P810S5
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9803P810S99
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9803P810W99
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9814P810A99
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9814P810S5
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9814P810W99
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9840P810
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9840P810A99
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
B39941B9840P810S5
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) Packaging : - Series : * Part Status : Last Time Buy Frequency - Center : - Bandwidth : - Insertion Loss : - Ratings : - Applications : - Mounting Type : - Package / Case : - Height (Max) : - Size / Dimension : -
0
100 in stock
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