Manufacturer : Aries Electronics Packaging : Bulk Series : 518 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Lo-PRO?file, 513 Part Status : Active Type : DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Phosphor Bronze Mounting Type : Through Hole, Right Angle, Vertical Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Phosphor Bronze Housing Material : Polyamide (PA46), Nylon 4/6 Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Phosphor Bronze Mounting Type : Through Hole, Right Angle, Horizontal Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Phosphor Bronze Housing Material : Polyamide (PA46), Nylon 4/6 Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : 518 Part Status : Active Type : SIP Number of Positions or Pins (Grid) : 10 (1 x 10) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Mill-Max Manufacturing Corp. Packaging : Tube Series : 101 Part Status : Active Type : DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid) : 22 (2 x 11) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin-Lead Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Alloy Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature : -55°C ~ 125°C

Manufacturer : Aries Electronics Packaging : Bulk Series : Lo-PRO?file, 513 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Phosphor Bronze Mounting Type : Through Hole, Right Angle, Vertical Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Phosphor Bronze Housing Material : Polyamide (PA46), Nylon 4/6 Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole, Right Angle, Vertical Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Tin Contact Finish Thickness - Mating : 200.0µin (5.08µm) Contact Material - Mating : Phosphor Bronze Mounting Type : Through Hole, Right Angle, Vertical Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Phosphor Bronze Housing Material : Polyamide (PA46), Nylon 4/6 Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole, Right Angle, Horizontal Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -55°C ~ 105°C

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Tin Contact Finish Thickness - Mating : 200.0µin (5.08µm) Contact Material - Mating : Phosphor Bronze Mounting Type : Through Hole, Right Angle, Horizontal Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Phosphor Bronze Housing Material : Polyamide (PA46), Nylon 4/6 Operating Temperature : -