Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Phosphor Bronze Mounting Type : Through Hole, Right Angle, Horizontal Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Phosphor Bronze Housing Material : Polyamide (PA46), Nylon 4/6 Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Lo-PRO?file, 513 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 10.0µin (0.25µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole, Right Angle, Horizontal Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -55°C ~ 105°C

Manufacturer : Molex, LLC Packaging : Cut Tape (CT) Alternate Packaging Series : 105028 Part Status : Active Type : Camera Socket Number of Positions or Pins (Grid) : 32 (4 x 8) Pitch - Mating : 0.035" (0.90mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 12.0µin (0.30µm) Contact Material - Mating : Copper Alloy Mounting Type : Surface Mount Features : Open Frame Termination : Solder Pitch - Post : 0.035" (0.90mm) Contact Finish - Post : Nickel Contact Finish Thickness - Post : 50.0µin (1.27µm) Contact Material - Post : Copper Alloy Housing Material : Thermoplastic Operating Temperature : -

Manufacturer : Molex, LLC Packaging : Tray Series : 105142 Part Status : Active Type : LGA Number of Positions or Pins (Grid) : 2011 (47 x 58) Pitch - Mating : 0.040" (1.02mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 15.0µin (0.38µm) Contact Material - Mating : Copper Alloy Mounting Type : Surface Mount Features : Open Frame Termination : Solder Pitch - Post : 0.040" (1.01mm) Contact Finish - Post : - Contact Finish Thickness - Post : - Contact Material - Post : - Housing Material : Thermoplastic Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole, Right Angle, Vertical Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -

Manufacturer : Aries Electronics Packaging : Bulk Series : Vertisockets?800 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 10 (2 x 5) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole, Right Angle, Horizontal Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Brass Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature : -55°C ~ 105°C

Manufacturer : Aries Electronics Packaging : Bulk Series : PRS Part Status : Active Type : PGA, ZIF (ZIP) Number of Positions or Pins (Grid) : - Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Closed Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Tin Contact Finish Thickness - Post : 200.0µin (5.08µm) Contact Material - Post : Beryllium Copper Housing Material : Polyphenylene Sulfide (PPS) Operating Temperature : -65°C ~ 125°C

Manufacturer : Mill-Max Manufacturing Corp. Packaging : Tube Series : 110 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 8 (2 x 4) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Brass Alloy Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature : -55°C ~ 125°C

Manufacturer : Mill-Max Manufacturing Corp. Packaging : Tube Series : 110 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 14 (2 x 7) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Brass Alloy Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature : -55°C ~ 125°C

Manufacturer : Mill-Max Manufacturing Corp. Packaging : Tube Series : 110 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 14 (2 x 7) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame, Decoupling Capacitor Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Brass Alloy Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature : -55°C ~ 125°C

Manufacturer : Mill-Max Manufacturing Corp. Packaging : Tube Series : 110 Part Status : Active Type : DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid) : 16 (2 x 8) Pitch - Mating : 0.100" (2.54mm) Contact Finish - Mating : Gold Contact Finish Thickness - Mating : 30.0µin (0.76µm) Contact Material - Mating : Beryllium Copper Mounting Type : Through Hole Features : Open Frame Termination : Solder Pitch - Post : 0.100" (2.54mm) Contact Finish - Post : Gold Contact Finish Thickness - Post : 10.0µin (0.25µm) Contact Material - Post : Brass Alloy Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature : -55°C ~ 125°C