Chip Quik, Inc.
Manufacturer : Chip Quik Inc. Series : - Part Status : Active Type : Wire Solder Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter : 0.031" (0.79mm) Melting Point : 423 ~ 428°F (217 ~ 220°C) Flux Type : No-Clean, Water Soluble Wire Gauge : 20 AWG, 22 SWG Process : Lead Free Form : Spool, 8 oz (227g), 1/2 lb Shelf Life : Not Applicable Shelf Life Start : - Storage/Refrigeration Temperature : -
From $31.44
43 in stock